ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
ROHM recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The soldering iron temperature should not exceed 350°C (662°F) during hand soldering. Ensure the PCB is clean and dry before soldering, and use a solder with a melting point above 217°C (423°F).
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.3V ± 10%.
The EMP11FHT2R is not designed for use in high-humidity environments. ROHM recommends operating the device within a relative humidity range of 60% or less. If the device is exposed to high humidity, it may lead to reliability issues or even failure.
ROHM recommends storing the EMP11FHT2R in a dry, clean environment with a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures. During shipping, use anti-static packaging materials and avoid bending or flexing the leads.
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EMP11FHT2R Overview
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