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EN6310QA - Intel

Description: Enpirion Power Datasheet EN6310QA 1A PowerSoC Voltage Mode Synchronous PWM Buck with Integrated Inductor

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PCB Footprints
EN6310QA - Intel PCB footprint - Other - Other - EN6310QA-2
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3D Models
EN6310QA - Intel  - 3D model - Other - EN6310QA-2
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EN6310QA Details

  • Manufacturer Part Number:

    EN6310QA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 0.6 V TO 3.3 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XQCC-N30

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Seated Height-Max:

    1.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

EN6310QA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • The input power supply should be a low-noise, high-quality DC power source with a voltage range of 3.3V ± 10%. Ensure a minimum of 100 μF bulk capacitance and 10 μF ceramic capacitance.
  • Use the power-saving features, such as dynamic voltage and frequency scaling. Implement a low-power mode by reducing the clock frequency and voltage. Use a low-power oscillator and minimize I/O activity.
  • Use a shielded enclosure, ensure good grounding, and implement EMI filters on I/O lines. Follow Intel's guidelines for EMI and EMC compliance.

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