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EN6347QI - Intel

Description: Switching Voltage Regulators 4A High Eff Buck Con Integrated Inductor

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PCB Footprints
EN6347QI - Intel PCB footprint - Other - Other - EN6347QI-1
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3D Models
EN6347QI - Intel  - 3D model - Other - EN6347QI-1
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EN6347QI Details

  • Manufacturer Part Number:

    EN6347QI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.75 TO 6.24V; ALSO REQUIRE PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    6.6 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XQCC-N38

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Output Voltage-Max:

    6.24 V

  • Output Voltage-Min:

    0.75 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC38,.16X.28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

EN6347QI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • To ensure reliable operation across the entire temperature range, follow the recommended operating conditions, and consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow management.
  • Power sequencing should follow the recommended power-up sequence: VCC, then VCCIO, and finally VREF. Ensure a slow voltage ramp-up (typically 1-2 ms) to prevent damage to the device.
  • Implement ESD protection using TVS diodes or ESD arrays on the I/O lines. For latch-up prevention, ensure that the device is operated within the recommended operating conditions, and consider using a latch-up protection circuit if necessary.
  • Follow best practices for signal integrity by using controlled impedance routing, minimizing signal lengths, and avoiding signal crossing. Use a signal integrity analysis tool to optimize PCB routing.

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EN6347QI Overview

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