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EPC2001C - Efficient Power Conversion

Description: GANFET TRANS 100V 36A BUMPED DIE Enhancement Mode Power Transistor

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EPC2001C - Efficient Power Conversion PCB footprint - Other - Other - EPC2001C-2
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EPC2001C - Efficient Power Conversion  - 3D model - Other - EPC2001C-2
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EPC2001C Details

  • Manufacturer Part Number:

    EPC2001C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, DIE-11

  • ECCN Code:

    EAR99

  • Manufacturer:

    Efficient Power Conversion

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    36 A

  • Drain-source On Resistance-Max:

    0.007 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XXUC-X11

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    11

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    UNCASED CHIP

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UNSPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    GALLIUM NITRIDE

EPC2001C Frequently Asked Questions (FAQs)

  • The EPC2001C has an operating temperature range of -55°C to 150°C, making it suitable for high-reliability applications.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and consider using a voltage regulator or biasing circuit to maintain stable operation.
  • For optimal thermal performance, use a multi-layer PCB with thermal vias, and consider using a heat sink or thermal interface material to dissipate heat. Follow the recommended PCB layout guidelines in the datasheet and application notes.
  • Handle the EPC2001C with ESD-safe materials and tools, and consider using ESD protection devices or circuits in your design. Also, follow proper storage and handling procedures to prevent damage from moisture, vibration, and other environmental factors.
  • The recommended drive circuits and gate resistors for the EPC2001C are outlined in the datasheet and application notes. In general, use a low-impedance gate driver with a suitable gate resistor to ensure fast switching times and minimal ringing.

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