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EPCQ16ASI8N - Intel

Description: FPGA - Configuration Memory

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EPCQ16ASI8N - Intel PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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EPCQ16ASI8N - Intel  - 3D model - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EPCQ16ASI8N
  • Part Number EPCQ16ASI8N
  • Manufacturer Intel
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
  • Released Date Feb 20, 2018
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EPCQ16ASI8N Details

  • Manufacturer Part Number:

    EPCQ16ASI8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SOIC-8

  • ECCN Code:

    3A991

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.3

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

EPCQ16ASI8N Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the EPCQ16ASI8N is 0°C to 85°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • To ensure signal integrity, use controlled impedance PCB traces, maintain a consistent signal return path, and consider using signal conditioning components like series terminations or AC coupling capacitors.
  • The maximum power consumption of the EPCQ16ASI8N is approximately 1.5W, but this can vary depending on the specific use case and operating conditions.
  • No, the EPCQ16ASI8N is not designed for radiation-hardened or high-reliability applications. For such applications, consider using a radiation-hardened or high-reliability variant of the device.
  • Implement a POR circuit using a voltage supervisor IC or a discrete circuit with a voltage detector, a reset generator, and a capacitor to ensure a reliable and efficient power-on reset.

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