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EPCS16SI8N - Intel

Description: FPGA - Configuration Memory IC - Ser. Config Mem Flash 16Mb 40 MHz

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EPCS16SI8N - Intel PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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EPCS16SI8N - Intel  - 3D model - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EPCS16SI8N
  • Part Number EPCS16SI8N
  • Manufacturer Intel
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
  • Released Date Jun 2, 2017
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EPCS16SI8N Details

  • Manufacturer Part Number:

    EPCS16SI8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

EPCS16SI8N Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the EPCS16SI8N is -40°C to 85°C.
  • To ensure data integrity, use the WP# (Write Protect) pin to prevent writes during power-down or power-up cycles. Additionally, use the HLD (Hold) pin to prevent writes during power-down or power-up cycles.
  • The EPCS16SI8N supports a maximum clock frequency of 66 MHz.
  • During power-down or power-up cycles, ensure that the HOLD# and WP# pins are driven high to prevent unwanted writes or data corruption.
  • The RDY/BUSY# pin indicates the status of the device. When low, it indicates that the device is busy or in a programming cycle. When high, it indicates that the device is ready for the next operation.

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