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ER1B - Diotec

Description: Rectifiers Diode, Superfast, SMA, 100V, 1A, 150C

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Symbol
ER1B - Diotec - PCB symbol
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PCB Footprints
ER1B - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - SMA ~ DO-214AC
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3D Models
ER1B - Diotec - 3D model - Diodes Moulded - SMA ~ DO-214AC
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ER1B Details

  • Manufacturer Part Number:

    ER1B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.07

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    33 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    5

ER1B Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom side of the board, connected to the thermal pad of the ER1B. This helps to dissipate heat efficiently. Additionally, it's recommended to have vias under the thermal pad to connect it to the copper area.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the ER1B. Additionally, consider using a heat sink or a thermal interface material to reduce the thermal resistance between the device and the ambient environment.
  • Although the datasheet doesn't specify a maximum allowed voltage spike or transient, it's generally recommended to limit the input voltage to ±10% of the nominal input voltage to ensure reliable operation. For higher voltage spikes, consider adding a transient voltage suppressor (TVS) or a voltage clamp to protect the ER1B.
  • The ER1B is not designed for high-frequency switching applications. It's primarily intended for linear voltage regulation. If you need a high-frequency switching regulator, consider using a different device specifically designed for that purpose.
  • To calculate the power dissipation of the ER1B, use the following formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Make sure to consider the thermal resistance and the maximum junction temperature to ensure reliable operation.

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ER1B Overview

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For a full list of alternate parts for ER1B, check out Findchips.com