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ERA6ARB3012V - Panasonic

Description: Panasonic ERA6A Series Metal Film Surface Mount Resistor 0805 Case 30.1kΩ ±0.1% 0.125W ±10ppm/°C

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PCB Footprints
ERA6ARB3012V - Panasonic PCB footprint - Other - Other - ERA6A
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3D Models
ERA6ARB3012V - Panasonic  - 3D model - Other - ERA6A
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ERA6ARB3012V Details

  • Manufacturer Part Number:

    ERA6ARB3012V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    30100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    10 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

ERA6ARB3012V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERA6ARB3012V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERA6ARB3012V, ensure that the component is placed on a thermal land with a size of at least 2mm x 2mm, and that the thermal land is connected to a ground plane or a thermal via to dissipate heat efficiently.
  • The recommended soldering temperature profile for ERA6ARB3012V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, ERA6ARB3012V is designed to withstand high-vibration environments. However, it's recommended to follow the recommended mounting and soldering procedures to ensure the component is securely attached to the PCB. Additionally, consider using a vibration-dampening material or a mechanical fixative to further reduce the risk of component detachment.
  • To ensure the reliability of ERA6ARB3012V in a humid environment, apply a conformal coating to the PCB to prevent moisture ingress. Additionally, consider using a moisture-resistant packaging material and ensure that the component is stored in a dry environment before assembly.

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ERA6ARB3012V Overview

Use the download button to access the ERA6ARB3012V schematic symbol, PCB footprint, and 3D model.
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Part Image BLU0805-3012-BB10Q RCD Components Inc

Fixed Resistor, Thin Film, 0.125W, 30100ohm, 100V, 0.1% +/-Tol, 10ppm/Cel, Surface Mount, 0805, CHIP

Part Image BLU0805ER-3012-BB10Q RCD Components Inc

Fixed Resistor, Thin Film, 0.125W, 30100ohm, 100V, 0.1% +/-Tol, 10ppm/Cel, 0805,

Part Image BLU0805ER-3012-BT10W RCD Components Inc

Fixed Resistor, Thin Film, 0.125W, 30100ohm, 100V, 0.1% +/-Tol, 10ppm/Cel, 0805,

Part Image BLU0805A-3012-BT10Q RCD Components Inc

Fixed Resistor, Thin Film, 0.125W, 30100ohm, 100V, 0.1% +/-Tol, 10ppm/Cel, 0805,

Part Image BLU0805M-3012-BT10Q RCD Components Inc

Fixed Resistor, Thin Film, 0.125W, 30100ohm, 100V, 0.1% +/-Tol, 10ppm/Cel, 0805,

For a full list of alternate parts for ERA6ARB3012V, check out Findchips.com