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ERA8AEB181V - Panasonic

Description: Panasonic ERA Series Thin Film Surface Mount Resistor 1206 Case 180Ω ±0.1% 0.25W ±25ppm/°C

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ERA8AEB181V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERA8A
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ERA8AEB181V - Panasonic  - 3D model - Resistor Chip - ERA8A
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ERA8AEB181V Details

  • Manufacturer Part Number:

    ERA8AEB181V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    180 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

ERA8AEB181V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERA8AEB181V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERA8AEB181V, ensure that the component is placed on a thermal land with a size of at least 2mm x 2mm, and that the thermal land is connected to a ground plane or a thermal via to dissipate heat. Additionally, avoid placing heat-sensitive components near the ERA8AEB181V.
  • The maximum operating temperature range for ERA8AEB181V is -55°C to +125°C, with a derating of 1.25mW/°C above 70°C.
  • To ensure the reliability of ERA8AEB181V in high-vibration environments, use a robust mounting method such as soldering or adhesive bonding, and ensure that the component is securely attached to the PCB. Additionally, consider using a vibration-dampening material or a shock-absorbing mounting system.
  • The recommended storage condition for ERA8AEB181V is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the components in direct sunlight or near heat sources.

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ERA8AEB181V Overview

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