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ERA8AEB331V - Panasonic

Description: Res Thin Film 1206 0.25W 330R 0.1% Panasonic ERA Series Thin Film Surface Mount Resistor 1206 Case 330Ω ±0.1% 0.25W ±25ppm/°C

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ERA8AEB331V - Panasonic - PCB symbol
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PCB Footprints
ERA8AEB331V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERA8A
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ERA8AEB331V - Panasonic - 3D model - Resistor Chip - ERA8A
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ERA8AEB331V Details

  • Manufacturer Part Number:

    ERA8AEB331V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    330 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

ERA8AEB331V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERA8AEB331V is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERA8AEB331V, ensure that the component is mounted on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance is ≤10°C/W.
  • The recommended reflow soldering profile for ERA8AEB331V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The temperature should rise at a rate of 3°C/second and fall at a rate of 6°C/second.
  • Yes, ERA8AEB331V is suitable for high-frequency applications up to 100 MHz. However, it's essential to consider the component's self-resonance frequency and impedance characteristics when designing the circuit.
  • To ensure the reliability of ERA8AEB331V in harsh environments, follow the recommended storage and handling procedures, and ensure that the component is properly soldered and cleaned. Additionally, consider using conformal coating or potting to protect the component from moisture and contaminants.

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ERA8AEB331V Overview

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Fixed Resistor, Thin Film, 0.25W, 330ohm, 150V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 1206, CHIP