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ERJ12SF2491U - Panasonic

Description: PANASONIC - ERJ12SF2491U - SMD Chip Resistor, 2010 [5025 Metric], 2.49 kohm, ERJ12S Series, 200 V, Thick Film, 750 mW

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Symbol
ERJ12SF2491U - Panasonic - PCB symbol
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PCB Footprints
ERJ12SF2491U - Panasonic PCB footprint - Other - Other - ERJ12(S/Z)
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3D Models
ERJ12SF2491U - Panasonic - 3D model - Other - ERJ12(S/Z)
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ERJ12SF2491U Details

  • Manufacturer Part Number:

    ERJ12SF2491U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.75 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    2490 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ12SF2491U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ12SF2491U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ12SF2491U, ensure good thermal conduction by using a thermal pad or via under the component. Keep the component away from heat sources and ensure good airflow around the component. The maximum operating temperature is 125°C, and the storage temperature range is -55°C to 150°C.
  • The moisture sensitivity level of ERJ12SF2491U is MSL 2, which means it can withstand a maximum of 24 hours of exposure to a humidity level of 60% at 30°C before soldering.
  • Yes, ERJ12SF2491U is designed to withstand vibrations up to 10G (10 times the acceleration due to gravity) in the frequency range of 10Hz to 2000Hz. However, it's recommended to perform additional testing and validation for specific vibration requirements.
  • The recommended soldering profile for ERJ12SF2491U is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.

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ERJ12SF2491U Overview

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Part Image MC2010-2491-FB101W RCD Components Inc

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Part Image RS10K2491FBL Fenghua (HK) Electronics Ltd

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