The recommended land pattern for ERJ1GNF5102C is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the ERJ1GNF5102C should be placed on a flat, even surface to prevent warping or deformation. The component should be aligned with the PCB pads and secured with a gentle pressure to ensure proper solder wetting. The recommended reflow temperature profile is 250°C for 10-30 seconds.
The maximum power rating for ERJ1GNF5102C is 1/4W (250mW) at an ambient temperature of 70°C. However, the power rating may be derated at higher temperatures, and the component should be used within the recommended operating temperature range of -55°C to 125°C.
Yes, ERJ1GNF5102C is suitable for high-frequency applications up to 1GHz. However, the component's performance may be affected by parasitic inductance and capacitance, and the user should consider these factors when designing the circuit. Additionally, the component's self-resonant frequency is around 2.5GHz.
ERJ1GNF5102C should be stored in a dry, cool place away from direct sunlight and moisture. The component should be handled with care to prevent mechanical stress, bending, or twisting. It is recommended to use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ERJ1GNF5102C Overview
Use the download button to access the ERJ1GNF5102C schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ1G,
or try a keyword search, such as Fixed Resistors
