The recommended land pattern for ERJ1GNF6041C is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the ERJ1GNF6041C should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
The maximum power rating for ERJ1GNF6041C is 1/4W (250mW) at an ambient temperature of 70°C. However, the power rating may be derated depending on the operating temperature and other environmental factors.
Yes, ERJ1GNF6041C is suitable for high-frequency applications up to 1GHz. The component has a low inductance and high-frequency impedance, making it suitable for use in high-frequency circuits such as RF amplifiers and filters.
ERJ1GNF6041C should be stored in a dry, cool place away from direct sunlight and moisture. The component should be handled with care to prevent mechanical damage, and electrostatic discharge (ESD) precautions should be taken to prevent damage from static electricity.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ERJ1GNF6041C Overview
Use the download button to access the ERJ1GNF6041C schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ1G,
or try a keyword search, such as Fixed Resistors
