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ERJ2BQFR33X - Panasonic

Description: Low Resistance Thick Film Chip Resistor, 0402, 0.25W

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Symbol
ERJ2BQFR33X - Panasonic - PCB symbol
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PCB Footprints
ERJ2BQFR33X - Panasonic PCB footprint - Other - Other - ERJ_2LW_2BW_2B_(0402)
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3D Models
ERJ2BQFR33X - Panasonic - 3D model - Other - ERJ_2LW_2BW_2B_(0402)
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ERJ2BQFR33X Details

  • Manufacturer Part Number:

    ERJ2BQFR33X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.166 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.33 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,250 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.2341 V

ERJ2BQFR33X Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ2BQFR33X is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, ERJ2BQFR33X is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
  • For reflow soldering, it's recommended to use a peak temperature of 260°C with a dwell time of 20-30 seconds. The component should be placed on a solder paste with a thickness of 0.1-0.2mm, and the reflow profile should be controlled to prevent overheating.
  • Yes, ERJ2BQFR33X is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive and can be used with lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • ERJ2BQFR33X should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.

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ERJ2BQFR33X Overview

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Part Image ERJ2BSFR33X Panasonic Electronic Components

Fixed Resistor, Metal Glaze/thick Film, 0.166W, 0.33ohm, 0.2341V, 1% +/-Tol, 0,250ppm/Cel, Surface Mount, 0402, CHIP