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ERJ3EKF1823V - Panasonic

Description: Panasonic ERJ3EK Series Precision Thick Film Surface Mount Resistor 0603 Case 182kΩ ±1% 0.1W ±100ppm/°C

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PCB Footprints
ERJ3EKF1823V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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ERJ3EKF1823V - Panasonic  - 3D model - Other - ERJ3G(0603)
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ERJ3EKF1823V Details

  • Manufacturer Part Number:

    ERJ3EKF1823V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    182000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF1823V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF1823V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, ERJ3EKF1823V is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
  • For reflow soldering, it's recommended to use a peak temperature of 260°C with a dwell time of 10-30 seconds. The component should be placed on a solder paste with a thickness of 0.1-0.2mm, and the reflow profile should be controlled to prevent overheating.
  • Yes, ERJ3EKF1823V is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive and can be used with lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • ERJ3EKF1823V should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.

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ERJ3EKF1823V Overview

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Part Image RC0603FR-07182KP YAGEO Corporation

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Part Image NS03WAF1823T5E Royal Electronic Factory (Thailand) Co Ltd

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Part Image CRCW0603182KFKEC Vishay Intertechnologies

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Part Image RK73H1JLTP1823F KOA Speer Electronics Inc

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For a full list of alternate parts for ERJ3EKF1823V, check out Findchips.com