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ERJ3EKF3003V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ3EKF3003V - RES, THICK FILM, 300K, 1%, 0.1W, 0603

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ERJ3EKF3003V - Panasonic - PCB symbol
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PCB Footprints
ERJ3EKF3003V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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3D Models
ERJ3EKF3003V - Panasonic - 3D model - Other - ERJ3G(0603)
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ERJ3EKF3003V Details

  • Manufacturer Part Number:

    ERJ3EKF3003V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    300000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF3003V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF3003V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ3EKF3003V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJ3EKF3003V is 0.25W. It is recommended to derate the power rating based on the operating temperature and other environmental factors to ensure reliable operation.
  • Yes, ERJ3EKF3003V is compatible with lead-free soldering. The component is designed to withstand the higher temperatures required for lead-free soldering and meets the requirements of the RoHS directive.
  • The moisture sensitivity level (MSL) of ERJ3EKF3003V is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity without requiring baking before reflow soldering.

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ERJ3EKF3003V Overview

Use the download button to access the ERJ3EKF3003V schematic symbol, PCB footprint, and 3D model.
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