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ERJ3EKF4751V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ3EKF4751V - RES, THICK FILM, 4K75, 1%, 0.1W, 0603

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ERJ3EKF4751V - Panasonic - PCB symbol
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PCB Footprints
ERJ3EKF4751V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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3D Models
ERJ3EKF4751V - Panasonic - 3D model - Other - ERJ3G(0603)
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ERJ3EKF4751V Details

  • Manufacturer Part Number:

    ERJ3EKF4751V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    4750 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF4751V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF4751V is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material if the application requires high power dissipation.
  • The recommended soldering profile for ERJ3EKF4751V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/second or less.
  • To ensure reliability in high-vibration applications, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material or potting compound to reduce mechanical stress.
  • To protect ERJ3EKF4751V from electrostatic discharge (ESD), handle the component in an ESD-controlled environment, use ESD-protective packaging, and consider adding ESD protection devices in the circuit design.

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ERJ3EKF4751V Overview

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ERJ3EKF4751V Alternates

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Part Image RC0603FR-134K75L YAGEO Corporation

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Part Image CRCW06034K75FKEBC Vishay Intertechnologies

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Part Image HFWF03FV-4751 Hitano Enterprise Corp

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Part Image ADF06034K751%100PPM/KKP10 Microtech GmbH Electronic

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 4750ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image CRCW06034K75FKEL Vishay Intertechnologies

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 4750ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for ERJ3EKF4751V, check out Findchips.com