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ERJ3EKF5111V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ3EKF5111V - RES, 5K11, 1%, 0.1W, 0603

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ERJ3EKF5111V - Panasonic - PCB symbol
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PCB Footprints
ERJ3EKF5111V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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ERJ3EKF5111V - Panasonic - 3D model - Other - ERJ3G(0603)
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ERJ3EKF5111V Details

  • Manufacturer Part Number:

    ERJ3EKF5111V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    5110 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF5111V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF5111V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • During reflow soldering, the ERJ3EKF5111V should be placed on a flat surface, and the peak reflow temperature should not exceed 260°C. The component should be exposed to the reflow temperature for no more than 20 seconds.
  • The MSL of ERJ3EKF5111V is level 3, which means it can withstand a maximum of 168 hours of exposure to 30°C/60%RH before reflow soldering.
  • While the ERJ3EKF5111V is rated for operation up to 125°C, it's not recommended for continuous operation above 105°C. If your application requires high-temperature operation, consider using a different component or consulting with a Panasonic representative.
  • Store ERJ3EKF5111V components in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -10°C and 30°C, and the relative humidity should be below 60%.

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ERJ3EKF5111V Overview

Use the download button to access the ERJ3EKF5111V schematic symbol, PCB footprint, and 3D model.
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