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ERJ3EKF61R9V - Panasonic

Description: 61.9Ω 0603 Thick Film Precision Thick Film Surface Mount Resistor ±1% 0.1W ERJ3EKF61R9V

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PCB Footprints
ERJ3EKF61R9V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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ERJ3EKF61R9V - Panasonic  - 3D model - Other - ERJ3G(0603)
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ERJ3EKF61R9V Details

  • Manufacturer Part Number:

    ERJ3EKF61R9V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    61.9 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF61R9V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF61R9V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ3EKF61R9V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The ERJ3EKF61R9V is a general-purpose resistor and is not specifically designed for high-frequency applications. However, it can be used up to 100 MHz with minimal signal attenuation. For higher frequencies, a high-frequency resistor with a lower inductance and capacitance should be considered.
  • The ERJ3EKF61R9V has a maximum operating temperature of 125°C. While it can tolerate short-term excursions up to 150°C, prolonged exposure to high temperatures can affect its reliability and lifespan. If your application requires operation above 125°C, a high-temperature resistor should be considered.
  • The ERJ3EKF61R9V has a power rating of 0.1W. To ensure it meets your application's power rating requirements, calculate the maximum power dissipation using the formula P = V^2/R, where V is the voltage across the resistor and R is the resistance value. Ensure the calculated power is below the maximum rating of 0.1W.

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ERJ3EKF61R9V Overview

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