The recommended land pattern for ERJ3EKF8200V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
To prevent damage, handle the ERJ3EKF8200V by the body only, avoiding touching the terminals. Use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge. Avoid bending or flexing the component during assembly.
The maximum soldering temperature for ERJ3EKF8200V is 260°C (500°F) for a maximum of 10 seconds. Exceeding this temperature or time may damage the component.
Yes, ERJ3EKF8200V is designed to withstand vibrations up to 10G (98m/s²) in the frequency range of 10Hz to 2000Hz. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
Store ERJ3EKF8200V in its original packaging or in a dry, cool place with a relative humidity of 60% or less. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures. The recommended storage temperature range is -10°C to 40°C (14°F to 104°F).
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ERJ3EKF8200V Overview
Use the download button to access the ERJ3EKF8200V schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ3E,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
