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ERJ3RED2003V - Panasonic

Description: Panasonic Thick Film Surface Mount Resistor 603 Case 200kΩ ±0.5% 0.1W ±100ppm/°C

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Symbol
ERJ3RED2003V - Panasonic - PCB symbol
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PCB Footprints
ERJ3RED2003V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJ3RBD
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3D Models
ERJ3RED2003V - Panasonic - 3D model - Resistor Chip - ERJ3RBD
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ERJ3RED2003V Details

  • Manufacturer Part Number:

    ERJ3RED2003V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    200000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    75 V

ERJ3RED2003V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3RED2003V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ3RED2003V should be exposed to a peak temperature of 260°C for no more than 10 seconds. The component should be placed on a conveyor belt or pallet to prevent warpage, and the soldering atmosphere should be nitrogen or air with a low oxygen level.
  • The MSL of ERJ3RED2003V is level 2, which means it can be exposed to a maximum of 30°C and 60% relative humidity for 24 hours before soldering.
  • Yes, ERJ3RED2003V is designed to withstand high-vibration environments. However, it's recommended to follow the recommended mounting and soldering procedures to ensure reliable operation.
  • ERJ3RED2003V components should be stored in a dry, cool place with a relative humidity of 50% or less. They should be stored in their original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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ERJ3RED2003V Overview

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ERJ3RED2003V Alternates

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Part Image CR0603-10W-2003DPT VENKEL LTD

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 200000ohm, 75V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image HASG03DTEX2003A Hitano Enterprise Corp

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Part Image NRC-AS06D2003TRF NIC Components Corp

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 200000ohm, 75V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0603
Part Image RK73H1JLTDD2003D KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 200000ohm, 75V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for ERJ3RED2003V, check out Findchips.com