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ERJ3RQJR22V - Panasonic

Description: Low Resistance Thick Film Chip Resistor, 1127

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PCB Footprints
ERJ3RQJR22V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJ3RBD
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3D Models
ERJ3RQJR22V - Panasonic  - 3D model - Resistor Chip - ERJ3RBD
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ERJ3RQJR22V Details

  • Manufacturer Part Number:

    ERJ3RQJR22V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.22 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,300 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    0.1483 V

ERJ3RQJR22V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3RQJR22V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ3RQJR22V should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJ3RQJR22V is 0.25W. Exceeding this rating may cause the component to overheat, leading to reduced performance or even failure.
  • Yes, ERJ3RQJR22V is designed to withstand vibrations up to 10G (10 times the acceleration due to gravity). However, it's recommended to follow proper mounting and soldering techniques to ensure reliable operation in high-vibration environments.
  • Yes, ERJ3RQJR22V is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS (Restriction of Hazardous Substances) directive and can be soldered using lead-free solder alloys.

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ERJ3RQJR22V Overview

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