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ERJ8BWFR039V - Panasonic

Description: Panasonic ERJ8BW Series Thick Film Low Ohmic Surface Mount Resistor 1206 Case 39mΩ ±1% 1W ±150ppm/°C

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ERJ8BWFR039V - Panasonic - PCB symbol
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PCB Footprints
ERJ8BWFR039V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJ8B (W ONLY)
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3D Models
ERJ8BWFR039V - Panasonic - 3D model - Resistor Chip - ERJ8B (W ONLY)
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ERJ8BWFR039V Details

  • Manufacturer Part Number:

    ERJ8BWFR039V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    11

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.65 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    0.039 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,150 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1975 V

ERJ8BWFR039V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8BWFR039V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8BWFR039V, ensure that the component is placed on a thermal land with a size of at least 2mm x 2mm, and that the thermal land is connected to a ground plane or a thermal via to dissipate heat efficiently.
  • The maximum power rating for ERJ8BWFR039V is 0.5W, and it is recommended to derate the power by 50% to ensure reliable operation.
  • To ensure the reliability of ERJ8BWFR039V in high-temperature applications, ensure that the component is operated within its specified temperature range of -55°C to 125°C, and that the PCB is designed to minimize thermal stress and warpage.
  • The recommended soldering profile for ERJ8BWFR039V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/second or less.

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ERJ8BWFR039V Overview

Use the download button to access the ERJ8BWFR039V schematic symbol, PCB footprint, and 3D model.
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