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ERJ8ENF1203V - Panasonic

Description: Thick Film Chip Resistor 0.25W 1206 120K Panasonic ERJ Series Precision Thick Film Surface Mount Resistor 1206 Case 120kΩ ±1% 0.25W ±100ppm/°C

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ERJ8ENF1203V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF1203V - Panasonic  - 3D model - Other - ERJ8EN
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ERJ8ENF1203V Details

  • Manufacturer Part Number:

    ERJ8ENF1203V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    120000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF1203V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF1203V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • During reflow soldering, the ERJ8ENF1203V should be placed on a flat, even surface to prevent warping or deformation. The component should be aligned with the PCB pads and secured with a gentle pressure to ensure proper solder wetting. The recommended reflow temperature profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJ8ENF1203V is 0.5W. Exceeding this rating may cause the component to overheat, leading to reduced performance or even failure.
  • Yes, ERJ8ENF1203V is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The operating temperature range for ERJ8ENF1203V is -55°C to +125°C. The component is designed to operate within this temperature range without significant degradation of its electrical characteristics.

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ERJ8ENF1203V Overview

Use the download button to access the ERJ8ENF1203V schematic symbol, PCB footprint, and 3D model.
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Part Image CR1206-4W-1203FT-13 VENKEL LTD

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Part Image AC1206FR-13120KL YAGEO Corporation

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Part Image RMCG1206FT120K SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 120000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206

Part Image CRCW12061203FRT1 Vishay Intertechnologies

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 120000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206

For a full list of alternate parts for ERJ8ENF1203V, check out Findchips.com