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ERJ8ENF3163V - Panasonic

Description: PANASONIC - ERJ8ENF3163V - SMD Chip Resistor, 1206 [3216 Metric], 316 kohm, ERJ8E Series, 200 V, Thick Film, 250 mW

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ERJ8ENF3163V - Panasonic - PCB symbol
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PCB Footprints
ERJ8ENF3163V - Panasonic PCB footprint - Other - Other - ERJ8EN
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3D Models
ERJ8ENF3163V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF3163V Details

  • Manufacturer Part Number:

    ERJ8ENF3163V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    29 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    316000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF3163V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF3163V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8ENF3163V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the storage temperature range is -55°C to 150°C.
  • The moisture sensitivity level (MSL) of ERJ8ENF3163V is MSL 2, which means it can withstand a maximum of 4 days in a humidity-controlled environment before soldering.
  • Yes, ERJ8ENF3163V is designed to withstand vibrations up to 10G (10 times the acceleration due to gravity) in the frequency range of 10Hz to 200Hz, making it suitable for use in high-vibration environments.
  • The recommended soldering profile for ERJ8ENF3163V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be completed within 3 minutes.

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ERJ8ENF3163V Overview

Use the download button to access the ERJ8ENF3163V schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ8E, or try a keyword search, such as Fixed Resistors

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ERJ8ENF3163V Alternates

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Part Image TFA1206R3163F-T5 Thin Film Technology Corp (TFT)

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Part Image HASG06FVEV3163A Hitano Enterprise Corp

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Part Image SR12X3163FQL Walsin Technology Corporation

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Part Image MC1206P-3163-FBW RCD Components Inc

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 316000ohm, 200V, 1% +/-Tol, 100ppm/Cel, 1206,
Part Image NRCS12F3163TRF NIC Components Corp

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 316000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206
For a full list of alternate parts for ERJ8ENF3163V, check out Findchips.com