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ERJ8ENF3321V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ8ENF3321V - RES, THICK FILM, 3K32, 1%, 0.25W, 1206

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ERJ8ENF3321V - Panasonic - PCB symbol
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ERJ8ENF3321V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF3321V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF3321V Details

  • Manufacturer Part Number:

    ERJ8ENF3321V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks, 5 Days

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    3320 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF3321V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF3321V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8ENF3321V, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance is ≤10°C/W. Additionally, avoid placing heat-sensitive components near the ERJ8ENF3321V.
  • The maximum power rating for ERJ8ENF3321V is 0.5W. Exceeding this rating may cause the component to overheat, leading to reduced performance or failure.
  • Yes, ERJ8ENF3321V is suitable for high-frequency applications up to 100MHz. However, it's essential to consider the component's self-resonant frequency (SRF) and ensure that the operating frequency is below the SRF to avoid resonance and potential performance issues.
  • To ensure the reliability of ERJ8ENF3321V in a humid environment, follow the recommended storage and handling procedures, and consider applying a conformal coating to protect the component from moisture. Additionally, ensure that the component is properly soldered and that the PCB is designed with moisture-resistant materials.

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ERJ8ENF3321V Overview

Use the download button to access the ERJ8ENF3321V schematic symbol, PCB footprint, and 3D model.
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Part Image WR12X3321FGLV Walsin Technology Corporation

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Part Image CRCW12063K32FKTB Vishay Intertechnologies

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