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ERJ8GEYJ470V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ8GEYJ470V - RES, THICK FILM, 47R, 5%, 0.25W, 1206

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ERJ8GEYJ470V - Panasonic - PCB symbol
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PCB Footprints
ERJ8GEYJ470V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - 1206
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3D Models
ERJ8GEYJ470V - Panasonic - 3D model - Resistor Chip - 1206
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ERJ8GEYJ470V Details

  • Manufacturer Part Number:

    ERJ8GEYJ470V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    47 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

ERJ8GEYJ470V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8GEYJ470V is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, ERJ8GEYJ470V is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
  • For reflow soldering, it's recommended to use a peak temperature of 260°C with a dwell time of 20-30 seconds. The component should be placed on a solder paste with a thickness of 0.1-0.2mm, and the reflow profile should be controlled to prevent overheating.
  • Yes, ERJ8GEYJ470V is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive and can be used with lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • ERJ8GEYJ470V should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.

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ERJ8GEYJ470V Overview

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ERJ8GEYJ470V Alternates

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Part Image 1206S4J0470CCE Royal Electronic Factory (Thailand) Co Ltd

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