ERJ8RQF1R2V footprint, schematic symbol and 3D model by Panasonic

Symbol

PCB Footprints

3D Models

ERJ8RQF1R2V Details

The recommended land pattern for ERJ8RQF1R2V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations for ERJ8RQF1R2V, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The maximum operating temperature is 125°C, and the component should be derated above 85°C.
The recommended soldering process for ERJ8RQF1R2V is a reflow soldering process with a peak temperature of 260°C, and a dwell time of 30-60 seconds above 220°C. The component should be soldered using a Pb-free solder alloy.
To ensure the reliability of ERJ8RQF1R2V in high-vibration applications, ensure that the component is securely mounted to the PCB using a suitable adhesive or mechanical fastening method. Additionally, consider using a vibration-resistant termination method, such as a flexure-based termination.
The equivalent series resistance (ESR) of ERJ8RQF1R2V is approximately 0.1 ohms at 100 kHz, and 0.2 ohms at 1 MHz.

Manufacturer Collaborated

System Verified

Community Approved

Use the download button to access the ERJ8RQF1R2V schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like ERJ8R, or try a keyword search, such as Fixed Resistors

If you searched for ERJ8RQF1R2V, you might also be interested in these parts:

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →