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ERJ8RSFR18V - Panasonic

Description: Panasonic ERJ8RS Series Thick Film Low Ohmic Surface Mount Resistor 1206 Case 180mΩ ±1% 0.25W ±250ppm/°C

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Symbol
ERJ8RSFR18V - Panasonic - PCB symbol
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PCB Footprints
ERJ8RSFR18V - Panasonic PCB footprint - Other - Other - ERJ8R
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3D Models
ERJ8RSFR18V - Panasonic - 3D model - Other - ERJ8R
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ERJ8RSFR18V Details

  • Manufacturer Part Number:

    ERJ8RSFR18V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.18 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,250 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.2121 V

ERJ8RSFR18V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8RSFR18V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ8RSFR18V, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance is ≤10°C/W.
  • The recommended soldering profile for ERJ8RSFR18V is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, ERJ8RSFR18V is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure that the component is properly secured to the PCB.
  • To ensure the reliability of ERJ8RSFR18V in a humid environment, apply a conformal coating to the PCB, and ensure that the component is stored in a dry environment before assembly. The component should also be handled in accordance with the manufacturer's moisture sensitivity level (MSL) rating.

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ERJ8RSFR18V Overview

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