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ERJB1BF3R3U - Panasonic

Description: Panasonic ERJB1 Series Thick Film High Power Surface Mount Resistor 2010 Case 3.3Ω ±1% 1W ±100ppm/°C

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ERJB1BF3R3U - Panasonic - PCB symbol
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PCB Footprints
ERJB1BF3R3U - Panasonic PCB footprint - Other - Other - ERJ-B1BFR22U
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ERJB1BF3R3U - Panasonic - 3D model - Other - ERJ-B1BFR22U
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ERJB1BF3R3U Details

  • Manufacturer Part Number:

    ERJB1BF3R3U

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    3.3 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1020

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJB1BF3R3U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJB1BF3R3U is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • To handle thermal considerations for ERJB1BF3R3U, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 35°C/W. It's also essential to follow the recommended power derating curve to prevent overheating.
  • The recommended soldering profile for ERJB1BF3R3U is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The recommended soldering process is reflow soldering, and it's essential to follow the recommended soldering profile to prevent damage to the component.
  • Yes, ERJB1BF3R3U is compatible with lead-free soldering. The component is designed to meet the requirements of lead-free soldering, and it can withstand the higher temperatures associated with lead-free soldering processes.
  • The moisture sensitivity level (MSL) of ERJB1BF3R3U is MSL 2, which means that the component can be exposed to a relative humidity of 60% at 30°C for up to 72 hours without being damaged. It's essential to follow the recommended storage and handling procedures to prevent moisture-related damage.

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ERJB1BF3R3U Overview

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