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ERJB2CFR051V - Panasonic

Description: Panasonic ERJB2 Series Thick Film Fixed Resistor 0612 Case 51mΩ ±1% 1W 0 → +150ppm/°C

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PCB Footprints
ERJB2CFR051V - Panasonic PCB footprint - Other - Other - ERJB2_(0612)
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ERJB2CFR051V - Panasonic  - 3D model - Other - ERJB2_(0612)
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ERJB2CFR051V Details

  • Manufacturer Part Number:

    ERJB2CFR051V

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.051 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0612

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,150 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJB2CFR051V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJB2CFR051V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJB2CFR051V, ensure that the component is mounted on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 100°C/W or less.
  • The recommended reflow soldering profile for ERJB2CFR051V is a peak temperature of 260°C, with a dwell time above 220°C of 20-30 seconds. The recommended soldering process is a lead-free reflow process.
  • Yes, ERJB2CFR051V is designed to withstand high-vibration applications. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent damage.
  • Yes, ERJB2CFR051V is compatible with lead-free soldering. The component is designed to meet the requirements of the RoHS directive and can be soldered using lead-free solder alloys.

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ERJB2CFR051V Overview

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