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ERJL12KF10CU - Panasonic

Description: 0.5W, 1/5W Chip Resistor 1812 Automotive AEC-Q200, Current Sense Thick Film

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PCB Footprints
ERJL12KF10CU - Panasonic PCB footprint - Other - Other - ERJL12_(1812)
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ERJL12KF10CU - Panasonic  - 3D model - Other - ERJL12_(1812)
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ERJL12KF10CU Details

  • Manufacturer Part Number:

    ERJL12KF10CU

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    11

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    4.5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.1 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1812

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.2236 V

ERJL12KF10CU Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJL12KF10CU is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJL12KF10CU should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJL12KF10CU is 0.5W. However, the actual power rating may vary depending on the operating conditions, such as temperature and voltage. It's recommended to derate the power rating by 20-30% to ensure reliable operation.
  • Yes, ERJL12KF10CU is suitable for high-frequency applications up to 1GHz. However, the component's self-resonant frequency is around 100MHz, so it's recommended to use it in conjunction with other components to achieve the desired frequency response.
  • ERJL12KF10CU should be stored in a dry, cool place with a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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ERJL12KF10CU Overview

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