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ERJL12KF33MU - Panasonic

Description: 0.5W, 1/5W Chip Resistor 1812 Automotive AEC-Q200, Current Sense Thick Film

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Symbol
ERJL12KF33MU - Panasonic - PCB symbol
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PCB Footprints
ERJL12KF33MU - Panasonic PCB footprint - Other - Other - ERJL12_(1812)
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3D Models
ERJL12KF33MU - Panasonic - 3D model - Other - ERJL12_(1812)
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ERJL12KF33MU Details

  • Manufacturer Part Number:

    ERJL12KF33MU

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    10

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    4.5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.033 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1812

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    300 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1285 V

ERJL12KF33MU Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJL12KF33MU is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJL12KF33MU should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJL12KF33MU is 0.5W. However, the actual power rating may vary depending on the operating conditions, such as temperature and voltage. It's recommended to derate the power rating by 20-30% to ensure reliable operation.
  • Yes, ERJL12KF33MU is compatible with lead-free soldering. The component is designed to withstand the higher temperatures required for lead-free soldering, and the terminations are made of a lead-free material.
  • The moisture sensitivity level (MSL) of ERJL12KF33MU is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity without requiring baking or other special handling.

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ERJL12KF33MU Overview

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