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ERJP06F3300V - Panasonic

Description: Panasonic ERJP06 Series Thick Film Surface Mount Resistor 0805 Case 330Ω ±1% 0.5W ±100ppm/°C

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ERJP06F3300V - Panasonic - PCB symbol
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PCB Footprints
ERJP06F3300V - Panasonic PCB footprint - Other - Other - ERJP06(0805)
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3D Models
ERJP06F3300V - Panasonic - 3D model - Other - ERJP06(0805)
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ERJP06F3300V Details

  • Manufacturer Part Number:

    ERJP06F3300V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    330 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    400 V

ERJP06F3300V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP06F3300V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJP06F3300V, ensure good thermal conduction by using a thermal pad or a heat sink. The component's thermal resistance (Rth) is 35°C/W, so a thermal design that keeps the temperature below 125°C is recommended.
  • The recommended soldering profile for ERJP06F3300V is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/second. Hand soldering is not recommended.
  • Yes, ERJP06F3300V is designed to withstand vibrations up to 10G (10Hz-2kHz) and can be used in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure reliability.
  • Yes, ERJP06F3300V is compatible with lead-free soldering. The component is RoHS compliant and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.

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ERJP06F3300V Overview

Use the download button to access the ERJP06F3300V schematic symbol, PCB footprint, and 3D model.
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ERJP06F3300V Alternates

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Part Image ERJUP6F3300V Panasonic Electronic Components

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Part Image PWR05FTEU3300NA Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 330ohm, 400V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
Part Image HPWR05FVEU3300A Hitano Enterprise Corp

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 330ohm, 400V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805
For a full list of alternate parts for ERJP06F3300V, check out Findchips.com