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ERJP06F4021V - Panasonic

Description: Panasonic ERJP06 Series Thick Film Fixed Resistor 0805 Case 4.02kΩ ±1% 0.5W ±100ppm/°C

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ERJP06F4021V - Panasonic - PCB symbol
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PCB Footprints
ERJP06F4021V - Panasonic PCB footprint - Other - Other - ERJP06(0805)
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3D Models
ERJP06F4021V - Panasonic - 3D model - Other - ERJP06(0805)
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ERJP06F4021V Details

  • Manufacturer Part Number:

    ERJP06F4021V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    4020 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    400 V

ERJP06F4021V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP06F4021V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While ERJP06F4021V has a rated operating temperature range of -55°C to 125°C, it's essential to consider the derating curve and thermal management when using it in high-temperature applications. Ensure proper heat dissipation and follow the recommended thermal design guidelines to prevent overheating.
  • ERJP06F4021V is a moisture-sensitive device. To prevent damage, store it in a dry environment (less than 30% RH) and follow the recommended handling and storage procedures. If the component is exposed to moisture, bake it according to the manufacturer's guidelines before soldering.
  • The recommended soldering profile for ERJP06F4021V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure the soldering process is within the specified temperature range to prevent damage to the component.
  • Yes, ERJP06F4021V is compatible with lead-free soldering processes. However, ensure the soldering temperature and profile are within the recommended specifications to prevent damage to the component.

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ERJP06F4021V Overview

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