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ERJP06J561V - Panasonic

Description: Panasonic ERJP06 Series Thick Film Surface Mount Resistor 0805 Case 560Ω ±5% 0.5W ±200ppm/°C

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Symbol
ERJP06J561V - Panasonic - PCB symbol
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PCB Footprints
ERJP06J561V - Panasonic PCB footprint - Other - Other - ERJP06(0805)
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3D Models
ERJP06J561V - Panasonic - 3D model - Other - ERJP06(0805)
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ERJP06J561V Details

  • Manufacturer Part Number:

    ERJP06J561V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    560 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    400 V

ERJP06J561V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP06J561V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJP06J561V, ensure that the component is mounted on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 100°C/W or less.
  • The recommended soldering profile for ERJP06J561V is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/s.
  • Yes, ERJP06J561V is designed to withstand vibrations up to 10G (10Hz-2kHz) and can be used in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure reliability.
  • Yes, ERJP06J561V is compatible with lead-free soldering and is RoHS compliant. It's recommended to use a lead-free solder alloy with a melting point above 217°C.

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ERJP06J561V Overview

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