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ERJP08F62R0V - Panasonic

Description: Panasonic ERJP08 Series Thick Film Surface Mount Resistor 1206 Case 62Ω ±1% 0.66W ±100ppm/°C

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Symbol
ERJP08F62R0V - Panasonic - PCB symbol
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PCB Footprints
ERJP08F62R0V - Panasonic PCB footprint - Other - Other - ERJP08(1206)
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3D Models
ERJP08F62R0V - Panasonic - 3D model - Other - ERJP08(1206)
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ERJP08F62R0V Details

  • Manufacturer Part Number:

    ERJP08F62R0V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.66 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    62 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    500 V

ERJP08F62R0V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJP08F62R0V is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJP08F62R0V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the thermal resistance (Rth) is 250°C/W.
  • The recommended soldering profile for ERJP08F62R0V is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a cooling rate of 3-5°C/s.
  • Yes, ERJP08F62R0V is designed to withstand high-vibration environments. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress and vibration-induced failures.
  • Store ERJP08F62R0V in a dry, cool place, away from direct sunlight and moisture. Handle the components by the edges or the body, avoiding touching the terminals or the component surface to prevent electrostatic discharge (ESD) damage.

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ERJP08F62R0V Overview

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