ERJP6WF1001V footprint, schematic symbol and 3D model by Panasonic

Symbol

PCB Footprints

3D Models

ERJP6WF1001V Details

The recommended land pattern for ERJP6WF1001V is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the operating temperature within the recommended range of -55°C to 150°C.
The recommended soldering profile for ERJP6WF1001V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/second or less.
Yes, ERJP6WF1001V is designed to withstand high-vibration environments, but ensure proper mounting and soldering to prevent mechanical stress and damage.
To ensure reliability in a humid environment, apply a conformal coating to protect the component from moisture, and follow proper storage and handling procedures to prevent moisture absorption.

Machine Generated

System Verified

Community Approved

Use the download button to access the ERJP6WF1001V schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like ERJP6, or try a keyword search, such as Fixed Resistors

If you searched for ERJP6WF1001V, you might also be interested in these parts:

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →