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ERJPA2F1003X - Panasonic

Description: Anti-Surge Thick Film Chip Resistor, 0402, 0.2W

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Symbol
ERJPA2F1003X - Panasonic - PCB symbol
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PCB Footprints
ERJPA2F1003X - Panasonic PCB footprint - Other - Other - ERJPA2_(0402)
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3D Models
ERJPA2F1003X - Panasonic - 3D model - Other - ERJPA2_(0402)
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ERJPA2F1003X Details

  • Manufacturer Part Number:

    ERJPA2F1003X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.2 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    100000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

ERJPA2F1003X Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJPA2F1003X is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJPA2F1003X should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum power rating for ERJPA2F1003X is 0.5W. Exceeding this rating may cause the component to overheat and fail.
  • Yes, ERJPA2F1003X is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB.
  • ERJPA2F1003X components should be stored in a dry, cool place away from direct sunlight. The components should be stored in their original packaging or in a similar anti-static package to prevent electrostatic discharge (ESD) damage.

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ERJPA2F1003X Overview

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