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ERJPA3F7500V - Panasonic

Description: Panasonic ERJPA3 Series Thick Film Surface Mount Resistor 0603 Case 750Ω ±1% 0.25W ±100ppm/°C

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ERJPA3F7500V - Panasonic - PCB symbol
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PCB Footprints
ERJPA3F7500V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJPA3(0603)
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3D Models
ERJPA3F7500V - Panasonic - 3D model - Resistor Chip - ERJPA3(0603)
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ERJPA3F7500V Details

  • Manufacturer Part Number:

    ERJPA3F7500V

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    105 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    750 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJPA3F7500V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJPA3F7500V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJPA3F7500V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJPA3F7500V is 0.5W. Exceeding this rating may cause the component to overheat and fail.
  • Yes, ERJPA3F7500V is suitable for high-frequency applications up to 1GHz. However, the component's impedance and parasitic effects should be considered in the design to ensure optimal performance.
  • ERJPA3F7500V should be stored in a dry, cool place away from direct sunlight. The component should be handled with care to prevent mechanical stress, and electrostatic discharge (ESD) precautions should be taken to prevent damage.

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ERJPA3F7500V Overview

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Part Image RBX16K7500FTP Kamaya Inc

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