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ES1JFL - onsemi

Description: Ultra Thin Profile - Maximum Height of 1.08 mm; Glass Passivated Junction; RoHS Compliant / Green Mold Compound; Fast Switching Speed – Maximum Trr 35 ns; UL Flammability 94V-0 Classification; MSL level 1

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Symbol
ES1JFL - onsemi - PCB symbol
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PCB Footprints
ES1JFL - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL CASE 425AD Issue A
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3D Models
ES1JFL - onsemi - 3D model - Small Outline Diode Flat Lead - SOD-123FL CASE 425AD Issue A
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ES1JFL Details

  • Manufacturer Part Number:

    ES1JFL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Package Description:

    PACKAGE-2

  • Manufacturer Package Code:

    425AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    ULTRA FAST RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES1JFL Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND9173/D for more details.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Follow the ESD protection guidelines outlined in onsemi's application note AND8033/D. Implement ESD protection devices, such as TVS diodes, and ensure proper PCB layout and handling practices to prevent ESD damage.
  • Use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value of 1-10 μF for power supply decoupling. Place the capacitor close to the device's power pins to minimize inductance and ensure a stable power supply.
  • Follow the soldering and rework guidelines outlined in onsemi's application note AND8194/D. Use a soldering temperature of 260°C (max) and a rework temperature of 240°C (max) to prevent damage to the device.

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ES1JFL Overview

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