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ES2D - Diotec

Description: Rectifiers Diode, Superfast, SMB, 200V, 2A, 150C

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PCB Footprints
ES2D - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - SMB...
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ES2D Details

  • Manufacturer Part Number:

    ES2D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.19

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.02 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

ES2D Frequently Asked Questions (FAQs)

  • A good PCB layout for ES2D should ensure a low-impedance path for the high-frequency switching node, keep the input and output capacitors close to the device, and use a solid ground plane to reduce EMI.
  • Choose X7R or X5R ceramic capacitors with a voltage rating of at least 2x the input voltage. The capacitance value should be between 1uF to 10uF, depending on the specific application requirements.
  • The maximum allowed voltage drop across the ES2D device is typically around 1.5V to 2V, depending on the specific device variant and operating conditions. Exceeding this limit may affect the device's reliability and performance.
  • Ensure good thermal contact between the device and the PCB, use a thermal pad or thermal interface material, and provide adequate airflow around the device. The maximum junction temperature should not exceed 150°C.
  • The recommended soldering conditions for ES2D are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering profile that follows the JEDEC J-STD-020 standard.

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ES2D Overview

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Part Image ES2D Sangdest Microelectronics (Nanjing) Co Ltd

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Part Image ES2D Vishay Intertechnologies

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Part Image ES2D General Instrument Corp

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