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ES2D - onsemi

Description: Superfast recovery time for highefficiency.; Built-in strain relief. ; Low profile package. ; For surface mount applications. ; Glass passivated junction.

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PCB Footprints
ES2D - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB,JEDEC DO-214, VARIATION AA
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3D Models
ES2D - onsemi  - 3D model - Diodes Moulded - SMB,JEDEC DO-214, VARIATION AA
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ES2D Details

  • Manufacturer Part Number:

    ES2D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Manufacturer Package Code:

    403AF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.02 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES2D Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ES2D device as close as possible to the input pins, using short and wide traces, and minimizing the distance between the device and the protected IC. Additionally, a ground plane underneath the device can help to reduce parasitic inductance.
  • To choose the correct ES2D device, consider the voltage rating, current rating, and package type required for your application. Also, consider the level of ESD protection needed, as well as any specific requirements for capacitance, leakage current, and operating temperature.
  • The maximum operating temperature for the ES2D device is 125°C, but it's recommended to operate the device within the specified temperature range for optimal performance and reliability.
  • Yes, the ES2D device can provide both ESD and overvoltage protection. However, it's essential to ensure that the device is properly sized for the specific application and that the overvoltage protection is designed to meet the required specifications.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point compatible with the device's package type. Also, ensure that the PCB is clean and free of contaminants, and that the device is handled by trained personnel to prevent damage.

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ES2D Overview

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Part Image ES2D-E3/52T Vishay Semiconductors

Rectifier Diode, 1 Phase, 1 Element, 2A, 200V V(RRM), Silicon, DO-214AA

Part Image ES2DHM3/5BT Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 2A, 200V V(RRM), Silicon, DO-214AA

Part Image ES2D Sangdest Microelectronics (Nanjing) Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 2A, 200V V(RRM), Silicon, DO-214AA

Part Image ES2D Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 2A, 200V V(RRM), Silicon

Part Image ES2D General Instrument Corp

Rectifier Diode, 1 Phase, 1 Element, 2A, 200V V(RRM), Silicon, DO-214AA

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