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ES3D - onsemi

Description: Low profile package. ; Built-in strain relief. ; Easy pick and place. ; Glass passivated junction. ; For surface mount applications. ; Superfast recovery times for highefficiency.

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PCB Footprints
ES3D - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - ES3DFSCT-ND
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3D Models
ES3D - onsemi  - 3D model - Diodes Moulded - ES3DFSCT-ND
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ES3D Details

  • Manufacturer Part Number:

    ES3D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Manufacturer Package Code:

    403AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.45

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    35 µs

  • Reverse Test Voltage:

    0.95 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES3D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for ES3D is -40°C to 125°C, but it can be extended to 150°C with some limitations.
  • ES3D is designed to be radiation-hardened and can withstand total ionizing dose (TID) effects up to 100 krad. However, it's essential to follow the recommended design and testing guidelines to ensure radiation tolerance.
  • Onsemi provides a PCB design guide for ES3D, which includes recommendations for layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • Yes, ES3D is designed for high-reliability applications, including aerospace, defense, and industrial control systems. It meets the requirements of various industry standards, such as MIL-STD-883 and NASA's EEE-INST-002.
  • ES3D is designed to be SEE-hardened and can withstand single-event upsets (SEUs) and single-event latchups (SELs). However, it's essential to implement additional error correction mechanisms to ensure data integrity.

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ES3D Overview

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