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ES3J - onsemi

Description: Glass passivated junction. ; Low profile package. ; Easy pick and place. ; Built-in strain relief. ; Superfast recovery times for highefficiency.; For surface mount applications.

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ES3J - onsemi PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - ES3J
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ES3J - onsemi  - 3D model - Diodes Moulded Non Polarised - ES3J
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ES3J Details

  • Manufacturer Part Number:

    ES3J

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC

  • Package Description:

    SMC, 2 PIN

  • Manufacturer Package Code:

    403AG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    35 µs

  • Reverse Test Voltage:

    1.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ES3J Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the enable pin (EN) is 6V, which is the maximum rating for the logic input. Exceeding this voltage may damage the device.
  • Yes, the ES3J is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended design and testing guidelines for these applications.
  • Use a soft-start circuit or a current limiter to control the inrush current during startup. This helps prevent damage to the device and reduces electromagnetic interference (EMI).

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ES3J Overview

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Part Image ES3J Fairchild Semiconductor Corporation

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Part Image ES3J Sangdest Microelectronics (Nanjing) Co Ltd

Rectifier Diode, 1 Phase, 1 Element, 3A, 600V V(RRM), Silicon, DO-214AB