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ESD0P4RFLE6327XTSA1 - Infineon

Description: ESD Suppressors / TVS Diodes RF ESD Protection Di dode

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Symbol
ESD0P4RFLE6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
ESD0P4RFLE6327XTSA1 - Infineon PCB footprint - Other - Other - TSLP-4-7_1
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3D Models
ESD0P4RFLE6327XTSA1 - Infineon - 3D model - Other - TSLP-4-7_1
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ESD0P4RFLE6327XTSA1 Details

  • Manufacturer Part Number:

    ESD0P4RFLE6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    1.20 X 0.80 MM, 0.39 MM HEIGHT, ROHS COMPLIANT, ULTRA SMALL, LEADLESS, TSLP-4-7, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N4

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

ESD0P4RFLE6327XTSA1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ESD0P4RFLE6327XTSA1 involves keeping the signal paths short, using a solid ground plane, and placing the device close to the antenna. Additionally, it's recommended to use a common ground plane for the device and the antenna to minimize electromagnetic interference.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device. It's also recommended to use a reflow oven with a controlled temperature profile.
  • The ESD0P4RFLE6327XTSA1 has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • The ESD0P4RFLE6327XTSA1 is an electrostatic-sensitive device and requires proper handling during storage and transportation. It's recommended to store the device in its original packaging, away from direct sunlight and moisture. Use anti-static bags or containers to prevent electrostatic discharge.
  • The recommended power supply voltage for the ESD0P4RFLE6327XTSA1 is 1.8V to 3.6V. However, it's recommended to use a voltage regulator to ensure a stable power supply and minimize noise and ripple.

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ESD0P4RFLE6327XTSA1 Overview

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