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ESD237B1W0201E6327XTSA1 - Infineon

Description: ESD Suppressors / TVS Diodes TVS DIODES

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PCB Footprints
ESD237B1W0201E6327XTSA1 - Infineon PCB footprint - Other - Other - WLL-2-1_2022
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ESD237B1W0201E6327XTSA1 Details

  • Manufacturer Part Number:

    ESD237B1W0201E6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    12 V

  • Breakdown Voltage-Min:

    9 V

  • Breakdown Voltage-Nom:

    10.5 V

  • Clamping Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    42 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    8 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

ESD237B1W0201E6327XTSA1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the Infineon application note AN2013-01, which provides guidelines for optimal performance and reliability.
  • Follow the recommended soldering profile and inspection guidelines outlined in the Infineon application note AN2013-02, which provides detailed information on soldering and inspection techniques.
  • The device has a thermal resistance of 250 K/W. Ensure proper thermal management by providing adequate heat dissipation paths, such as thermal vias and heat sinks, to prevent overheating and ensure reliable operation.
  • Yes, the ESD237B1W0201E6327XTSA1 is suitable for high-frequency applications up to 6 GHz. However, ensure proper PCB layout and decoupling to minimize signal degradation and electromagnetic interference.
  • Follow the ESD handling and storage guidelines outlined in the Infineon application note AN2013-03, which provides recommendations for preventing ESD damage during storage and shipping.

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ESD237B1W0201E6327XTSA1 Overview

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