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ESD5581N2T5G - onsemi

Description: Low Capacitance, 5.0 µF (Max); Low Clamping Voltage, 10 V; Small Body Outline Dimensions, 0.62 mm x 0.32 mm; Low Body Height, 0.3 mm; Stand−off Voltage, 5 V; IEC61000−4−2, Level 4 ESD Protection

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PCB Footprints
ESD5581N2T5G - onsemi PCB footprint - Other - Other - X2DFN2 1.0x0.6, 0.65P CASE 714AB ISSUE B
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ESD5581N2T5G - onsemi  - 3D model - Other - X2DFN2 1.0x0.6, 0.65P CASE 714AB ISSUE B
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ESD5581N2T5G Details

  • Manufacturer Part Number:

    ESD5581N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    7.5 V

  • Breakdown Voltage-Min:

    5.2 V

  • Breakdown Voltage-Nom:

    6.2 V

  • Clamping Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD5581N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD5581N2T5G involves placing the device close to the connector or interface, using short traces, and minimizing the distance between the device and the protected circuit. A ground plane under the device is also recommended.
  • To choose the correct ESD protection device, consider the interface type (e.g., USB, HDMI, Ethernet), the voltage and current requirements, and the level of ESD protection needed (e.g., IEC 61000-4-2). Consult the datasheet and application notes for guidance.
  • The ESD5581N2T5G is rated for operation from -40°C to 125°C. However, it's essential to consider the derating curves and thermal management in your design to ensure reliable operation.
  • Yes, the ESD5581N2T5G is designed to provide both ESD protection and overvoltage protection up to 12V. However, ensure that your design meets the specific requirements for overvoltage protection, such as TVS diode selection and PCB layout.
  • Follow the recommended soldering profile and handling procedures to prevent damage during assembly. Ensure the device is properly aligned and seated on the PCB, and that the solder joints are clean and free of defects.

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