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ESD7124MUTBG - onsemi

Description: Last Shipments - Low Capacitance ESD Protection Diodes for High Speed Data Lines

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PCB Footprints
ESD7124MUTBG - onsemi PCB footprint - Other - Other - UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O
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3D Models
ESD7124MUTBG - onsemi  - 3D model - Other - UDFN6, 1.8 x 2, 0.4P CASE 517CS ISSUE O
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ESD7124MUTBG Details

  • Manufacturer Part Number:

    ESD7124MUTBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UDFN-6

  • Package Description:

    UDFN6, 6 PIN

  • Manufacturer Package Code:

    517CS

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    6.5 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    24.9 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD7124MUTBG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal ESD protection involves placing the ESD7124MUTBG close to the input ports, using short traces, and minimizing the distance between the device and the protected components. Additionally, a solid ground plane and a low-impedance path to ground can help to reduce the impedance of the discharge path.
  • To choose the right ESD protection device, consider the following factors: the type and level of ESD protection required, the operating voltage and frequency of the system, the available board space and layout constraints, and the desired level of protection for the downstream components.
  • The ESD7124MUTBG is a specific device with a unique set of characteristics, such as its low capacitance and high surge capability. Compared to other onsemi ESD protection devices, it may have different features, such as a different number of channels, different voltage ratings, or different package options.
  • To ensure proper soldering and mounting, follow the recommended soldering profile and handling procedures, and use a soldering iron with a temperature-controlled tip. Also, make sure the PCB is designed with a suitable land pattern and that the device is properly aligned during assembly.
  • The ESD7124MUTBG is manufactured by onsemi, which has a reputation for producing high-quality and reliable components. The device meets industry standards for reliability and quality, such as AEC-Q101 and IEC 61000-4-2, and is backed by onsemi's warranty and support.

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ESD7124MUTBG Overview

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