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ESD7371HT1G - onsemi

Description: Stand−off Voltage: 5.3 V; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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ESD7371HT1G - onsemi - PCB symbol
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PCB Footprints
ESD7371HT1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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3D Models
ESD7371HT1G - onsemi - 3D model - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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ESD7371HT1G Details

  • Manufacturer Part Number:

    ESD7371HT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD-323

  • Package Description:

    SOD-323, 2 PIN

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    7 V

  • Clamping Voltage-Max:

    14 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    5.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ESD7371HT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for ESD7371HT1G involves keeping the device close to the protected line, using short traces, and minimizing the distance between the device and the protected component. Additionally, a ground plane should be used to reduce noise and improve ESD protection.
  • The ESD7371HT1G is designed to handle surge pulses up to 30A (8/20μs) and has a surge tolerance of 3A (8/20μs) according to IEC 61000-4-5. It can also withstand multiple ESD strikes without degradation.
  • The ESD7371HT1G has an operating temperature range of -40°C to 125°C, making it suitable for use in a wide range of applications, including automotive and industrial systems.
  • Yes, the ESD7371HT1G can be used in high-speed data lines, but it's essential to consider the device's capacitance (typically 0.4pF) and ensure it doesn't affect the signal integrity. The device is suitable for data rates up to 10 Gbps.
  • To prevent damage, it's essential to store the ESD7371HT1G in a dry, cool place, away from direct sunlight and moisture. Handling should be done with anti-static wrist straps or mats to prevent ESD damage. The device should be soldered using a low-temperature profile to prevent thermal stress.

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ESD7371HT1G Overview

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